• en
  • fr
  • de
  • it
  • ru
  • es
  • us

X-Line

Industries
Food & Beverage Oil, Mining & Minerals Metal Powders Waste & Recycling Chemicals & Plastics Coatings
Construction Features
  • Multifrequency vibration (MFV)
  • Two-side electric vibrating motors operating at 1,500 RPM, IP 65
  • All contact parts in AISI 304 stainless steel
  • Cover with suction and inspections holes

The X-Line circular range is offered with a single deck (CS) or double deck (CD) for separating particles (3 mm down to 5 μm) in difficult materials that are wet or dry, sticky, abrasive or agglomerative. It can be used for classification, scalping, safety screening, de-dusting and solid/liquid separation. It has a proven track record in screening all forms of powders including metal powders, glass, chemicals, plastics, recycled/crushed/burnt waste, aggregates, food, agricultural and many more applications.

CS 065.1, CS 095.1, CS 120.1: Circular single deck X-Line is  tailored to suit your specific requirements and is offered in three distinct size models ranging from 650 mm diameter to 1,200 mm diameter. Manufactured to high quality standards, the single deck is offered in stainless steel with gas purging and many accessories such as motor covers, different types of connections, stands, pneumatic lifting system, and clean-in-place systems. All contact parts can be customized with a mirror polish finishing.

To understand why X-Line multi-frequency screeners are so effective read more about the technology here.

Related Success Stories

Cosmetic Powders, 100, 250 and 500 micron cut point – using a X-Line 065

Screening three different make up powders at 100, 250 and 500 micron cut point, using a Virto X-Line 065 single deck

Sand, 500 micron cut point – using a X-line 065

Screening Sand at 500 micron cut point using a X-Line 065

The power of X-Line multi-frequency vibration

See the power of X-Line multi-frequency vibration

Water Bottle MFV Test

See the power of the Multi frequency technology

Aluminium Oxide, 30 micron cut point – using a X-Line CS 065

Screening Aluminium Oxide at a 30 micron cut point using a X-Line CS 065 single deck

Aluminium Powder, 100 micron cut point – using a Virto X-Line CS 065

Screening Aluminium Powder at a 100 micron cut point using a Virto X-Line CS 065 single deck

Aluminium Powder, 20 micron cut point – using a Virto X-Line CS 065

Screening Aluminium Powder at a 20 micron cut point using a Virto X-Line CS 065 single deck

Aluminum Hydroxide and Aluminium Fluoride, 44 micron cut point – using a X-Line CS 065

Screening Aluminum Hydroxide and Aluminium Fluoride at a 44 micron cut point using a X-Line CS 065 single deck

Ceralite, 50 micron cut point – using a Virto X-Line CS 065

Screening Ceralite at a 50 micron cut point using a Virto X-Line CS 065

Ceramic Microspheres, 100 and 40 micron cut point – using a Virto X-Line CS 065

Virto’s X-Line CS 065 single deck screens Ceramic Microspheres at 100 and 40 micron cut point with high efficiency

Copper, 40 micron cut point – using a Virto X-Line CS 065

Screening Copper with our Virto’s X-Line CS 095 single deck at 40 micron cut point.

Ferrosilicon, 300 and 4700 micron cut point – using a Virto X-Line CS 065

Screening Ferrosilicon at 300 and 4700 micron cut point using a Virto X-Line CS 065

Glass Powder, 44 micron cut point – using a Virto X-Line CS 065.1

Screening Glass Powder at 44 micron cut point using a Virto X-Line CS 065 single deck

Gluten, 200 micron cut point – using a Virto X-Line CS 065.1

Screening Gluten at a 200 micron cut point using a Virto X-Line CS 065.1

Gres Stoneware Powder, 50 micron cut point – using a Virto X-Line CS 065

Screening Gres Stoneware Powder at 50 micron cut point using a Virto X-Line CS 065

Iron Powder, 25 micron cut point – using a Virto X-Line CS 065

Iron Powder separated at a 25 micron cut point using a Virto X-LIne CS 065 singe deck

Metal Powder Mix separated at a 11 micron cut point – using a X-line CS 065

Metal Powder Mix separated at a 11 micron cut point using a Virto X-Line CS 065 single deck

Metal Powder, 11 and 20 micron cut point – using a Virto X-Line 065

Screening Metal Powder at 11 and 20 micron cut point using a Virto X-Line 065 single deck

Metal Powder, 11 and 20 micron cut point – using a Virto X-Line 065

Metal Powder separated at 11 and 20 micron cut point using a Virto X-Line 065

Metal Powder, 11 micron cut point – using a Virto X-Line CS 065.1

Screening Metal Powder at 11 micron cut point using a Virto X-Line CS 065 single deck

Metal Powder, 15 micron cut point – using a Virto X-Line CS 065

Screening Metal Powder at 15 micron cut point using a Virto X-Line CS 065

Metal Powder, 25 micron cut point – using a Virto X-Line CS 065

Screening Metal Powder, 25 micron cut point using a Virto X-Line CS 065 single deck

Mica Powder, 100 micron cut point – using a Virto X-Line CS 065

Virto X-Line CS 065 vibrating sieve screening mica at 100 micron

Nickel Alloy, 20 micron cut point – using a Virto X-Line 065

Screening of Nickel Alloy at a 20 micron cut point using a Virto X-Line 065 single deck

Nickel based Alloy Powder, 61 micron cut point – using a Virto X-Line CS 065

Screening of Nickel based Alloy Powder at a 61 micron cut point using a Virto X-Line CS 065 single deck

Perlite, 50 & 25 micron cut point – using a X-Line CS 065

Screening Perlite at 50 and 25 micron cut point using a X-Line CS 065

Perlite, 53 micron cut point – using a Virto X-Line CS 065

Screening Perlite at a 53 micron cut point using aVirto X-Line CS 065 single deck

Pigments, 44 micron cut point – using a Virto X-Line CS 065.1

Screening Pigments at a 44 micron cut point using a Virto X-Line CS 065.1

Silicon Carbide, 300 and 500 micron cut point – using a Virto X-Line CS 095

Screening Silicon Carbide at 300 and 500 micron cut point using a Virto X-Line CS 095 single deck

Silicon, 200 micron cut point – using a Virto X-Line CS 065

Screening Silicon at a 200 micron cut point using a Virto X-Line CS 065 single deck

Silver Powder, 6 micron cut point – using a Virto X-Line CS 065

Screening Silver Powder at a 6 micron cut point using a Virto X-Line CS 065 single deck

Synthetic Paraffin Wax, 20 micron cut point – using a Virto X-Line CS 065

Screening Synthetic Paraffin Wax at 20 micron cut point using a Virto X-Line CS 065 single deck

Tin Oxide, 100 micron cut point – using a X-Line CS 065

Screening of tin oxide with X-Line CS 065 at a 100 micron cut point

Tin, Copper, Silver Alloy, 6 micron cut point – using a Virto X-Line CS 065

Tin, Copper, Silver Alloy separated at a 6 micron cut point using a Virto X-Line CS 065 single deck

Titanium, 45 and 75 micron cut point – using a Virto X-Line CS 065

Screening Titanium at 45 and 75 micron cut point using a Virto X-Line CS 065 single deck

Tungsten Carbide Cobalt, 210 and 44 micron cut point – using a X-Line CS 065

Screening Tungsten Carbide Cobalt at 210 and 44 micron cut point using a Virto X-Line CS 065 single deck

Zinc Bronze Powder, 30 micron cut point – using a X-Line CS 065.1

Screening Zinc Bronze Powder, 30 micron cut point – using a X-Line CS 065.1

Zinc Oxide, 44 micron cut point – using a X-Line CS 065

Screening Zinc Oxide at a 44 micron cut point using a Virto X-Line CS 065 single deck

Zinc Powder, 80 micron cut point – using a Virto X-Line CS 065

Safety screening of Zinc Powder at 80 micron cut point using a X-Line CS 065 single deck

Zinc Stearate, 425 and 210 micron cut point – using a Virto X-Line CS 065

Virto X-Line CS 065 single deck screening Zinc Stearate at 425 and 210 micron cut point with no mesh blinding

Zirconium dioxide, 20 micron cut point – using a X-Line CS 065

Screening Zirconium dioxide at a 20 micron cut point using a X-Line CS 065 single deck

Quartz Sand, 100 micron cut point – using a Virto X-Line RS 1506 and CS 065

Screening Quartz Sand at a 100 micron cut point using Virto X-Line RS 1506 and a CS 065